Thermal management with carbon nanotube architectures (THEMA)

European Union

Status: finished project
Contract Number:
228539. European Commission's 7th Framework Programme FP7-NMP-2008-SMALL-2
Starting date 
1 January 2010
Ending date 
31 December 2012


The ultimate objective of the project is to implement carbon nanotube architectures in Si chip and ceramic/organic package platforms to remove excess heat from the components. The program requires and includes extensive research on:

  • Carbon nanotube synthesis being compatible with standard Si fabrication and ceramic/organic laminate technologies using catalytic chemical vapour deposition and plasmaenhanced chemica vapour deposition methods. The cooling efficiencies that are to be achieved using the novel carbon nanotube based coolers are 1 kW/cm2 for micro hot spots on Si chips, 100 W/cm2 for large area S chips and 5 W/cm2 for ceramics/polymer packages.
  • Direct synthesis of carbon nanotubes on Si chips and on ceramic/organic packages to form on component heat sinks and thermal vias using technologies that are directly applicable for large scale production.
  • Applicability of carbon nanotube based isotropic and anisotropic thermal interface materials transferred to electrical components by imprinting and soldering methods.
  • Experimental determination of thermal resistivities of interfaces that carbon nanotubes and adhesives based upon those form with other materials such as Si, SiO2, ceramics, polymers and metals.
  • Multiscale computational study of heat transport in terms of (a) phonon transport through interfaces using molecular dynamics simulations and (b) macroscopic heat transport using continuum models with the finite element method.
  • The potential pollution of laboratories and our environment due to production of nanotubes and use of devices with integrated carbon nanotube structures.


  1. Nanostructured Carbon Research Group, Microelectronics and Materials Physics Laboratories, University of Oulu, Finland.
  2. Bio, Electronics Materials and Packaging group, Chalmers University of Technology, Göteborg, Sweden.
  3. Nano-bio Spectroscopy Group, European Theoretical Spectroscopy, Facility (ETSF), Dpto. Física de Materiales, Universidad del País Vasco, Donostia-San Sebastian, Spain.
  4. IMEC TFCG Microsystems, Gent, Belgium.
  5. Department of Applied and Environmental Chemistry, Faculty of Science, University of Szeged, Hungary.
  6. ON Semiconductor, Oudenaarde, Belgium.
  7. SHT Smart High Tech AB, Kållered Office, Gothenburg , Sweden.

Collaborating partner

  1. Department of Mechanical Engineering and Materials Science, Rice University, Houston, Texas, USA


Juan Maria Garcia Lastra

Angel Rubio

Related Research Areas